With Nvidia having showcased their latest and greatest Turing architecture GPUs in Cologne (Germany), OEMs are wasting no time incorporating the GPU in their custom Grapics Card design.

GIGABYTE has launched 5 graphics cards – Geforce RTX 2080 Ti GAMING OC 11G, Geforce RTX 2080 Ti WINDFORCE OC 11G, Geforce RTX2080 GAMING OC 8G, Geforce RTX 2080 WINDFORCE OC 8G, and Geforce RTX 2070 GAMING OC 8G on August 20th, 2018 in Taipei (Taiwan). All these cards feature GIGABYTE WINDFORCE 3X cooling system with alternate spinning fans, RGB fusion, protection metal back plate, GIGABYTE certified ultra-durable materials and one-click overclocking.

The “WINDFORCE 3x cooling system” is equipped with 3 unique blade fans, High-efficiency pure copper composite heat-pipes directly touching the GPU and a semi-passive fan function. The middle fan spins in reverse to optimize airflow for heat dissipation. These together ensure that the graphics card temps remain at an acceptable level, resulting in a more stable performance. The graphics cards use multi-phase power supply design with Ultra Durable certified chokes and capacitors to provide excellent performance and longer system life. The one-click overclocking function provides 3 preset modes, and the user can easily switch settings according to their requirement. The back of the graphics card has a metal back plate that not only strengthens the overall structure, but also prevents the PCB from bending or falling parts. In addition, the Graphics cards also possess RGB LEDs for aesthetic appeal. The users can adjust the color of the lights and various lighting effects through AORUS Engine.

GIGABYTE will also be launching more AORUS series graphics cards for enthusiasts in the near future, including air-cooled and water-cooled designs, allowing gamers to have more choice to build an ultimate gaming machine.

Source: GIGABYTE

The post GIGABYTE Launches RTX 20 series Graphics Cards appeared first on OCFreaks!.

Broadcom, in what can only be perceived as a totally unexpected turn of events, has offered a bid of a whopping $130 bn to buy off Qualcomm. If this deal goes through, it would in-arguably be the biggest takeover in the Semiconductor industry(and believe me, the semiconductor industry has seen more than its fair share of high priced deals!), and would catapult Broadcom to the third position of the World’s largest chip makers (behind Intel and Samsung).

Broadcom’s offer of $70 per share to Qualcomm Stockholders would be broken down to $60 per share in cash and $10 per share of Broadcom. Broadcom says this is a 28% premium over the closing price of Qualcomm common stock on November 2.

In a press statement, Broadcom president and CEO Hock Tan presented the following views on the bid:

“This complementary transaction will position the combined company as a global communications leader with an impressive portfolio of technologies and products,”

“We would not make this offer if we were not confident that our common global customers would embrace the proposed combination,”

“With greater scale and broader product diversification, the combined company will be positioned to deliver more advanced semiconductor solutions for our global customers and drive enhanced stockholder value.”

While it seems natural to be skeptical of this deal going anywhere, the fact remains that Qualcomm is amidst an intense legal tiff with Apple, and has just been fined heavily by the Taiwanese FTC for unfairly licensing out it’s patents. So, the timing of this bid couldn’t be any better for both parties.

In a news release on Monday, Qualcomm said that their board of directors will assess the bid to pursue the course of action that would be in the best interests of Qualcomm shareholders.

The post Broadcom presents a bid of $130bn for Qualcomm appeared first on OCFreaks!.

Western Digital, in it’s “Innovating to Fuel the Next Decade of Big Data” event held at the company headquarters in Silicon Valley, uncovered it’s new breakthrough in Microwave Assisted Magnetic Recording (MAMR) Technology. The event involved a demonstration of the world’s first MAMR HDD and a few presentations detailing the technology.

According to the statements made by the WD, they will be focussing their efforts to using MAMR in their High Capacity Hard Disks in the near future and put HAMR (Heat Assisted Magnetic Recording), whose growth has been at a crawling pace, in the backburner. The reason provided by WD for this is that MAMR offers significant advantages to HAMR, at least for the time being. Below, you’ll find the numerous slides presented by WD explaining the same:

The main problem which contributed to MAMR remaining elusive till now was the implementation of the “Spin Torque Oscillator”(STO). The STO, simply put, is a microwave field generator operating at a frequency close to the Ferromagnetic Resonance of the platter. The microwave field generated by this is used to increase the ability to reliably record data at high densities. WD, it seems, has managed to find an innovative and efficient way to implement this.

Other developments made by WD that helped to pave the way to MAMR were their new improved Drive Heads and “Multi-Stage Micro Actuators”. WD has been using “Damascene” process to manufacture it’s Drive Heads with the precise tolerances and complex structures for reliable and cost-effective recording at ultra-high densities. The added advantage that this gives is that it enables the STO to be embedded in the Head Assembly without much further modification. The Micro Actuators were introduced to address the problem of accurate positioning of the Head assembly on High Data Density Disks. Increased track densities require finer control of the head that was unachievable using a single actuator, so a “micro actuator” was added to accurately position the head over the narrower tracks. This supports track densities of upto 400,000 TPI on a disk.

WD claims that using MAMR, they would be able to provide a data density of over 4 Terabits/sq.in(Platter Area). Also, using MAMR, they state that by 2025, they’d be able to provide hard drives with 40TB of capacity and beyond. These numbers are nothing short of astounding, and far surpass what the current expectations are using HAMR. So, it’s no surprise WD is betting all it’s money on this.

According to John Rydning(VP of research, IDC):

“Western Digital’s demonstration of MAMR technology is a significant breakthrough for the hard disk drive industry,”

“Commercialization of MAMR technology will pave the way to higher recording densities, and lower cost per terabyte hard disk drives for enterprise datacenters, video surveillance systems, and consumer NAS products.”

MAMR, as stated by WD, is another addition to it’s growing list of innovation in the HDD space, which includes Helium Filled HelioSeal HDDs.

Release Timeline:

Western Digital has also revealed a timeline of how MAMR based HDDs will be rolled out. The engineering samples will supposedly be distributed by mid 2018 to WD’s key datacenter customers. Production-level MAMR HDDs are expected to start shipping in 2019 for use in data centers that support Big Data applications across a full range of industries.

The post Western Digital unveils new Innovation in MAMR Technology, 40 TB HDDs by 2025 appeared first on OCFreaks!.

The story of Microsoft’s Windows Phone Operating System has been bittersweet, to say the least. Despite not being half bad, the lack of App Developers willing to develop for this platform and the inability of Microsoft to lure new users have led to the Windows Phone platform to be in a somewhat stagnant state.

Now, as seen by these recent tweets by Joe Belfiore(Microsoft’s Corporate VP):

Of course we'll continue to support the platform.. bug fixes, security updates, etc. But building new features/hw aren't the focus. 😟 https://t.co/0CH9TZdIFu

— Joe Belfiore (@joebelfiore) October 8, 2017

We have tried VERY HARD to incent app devs. Paid money.. wrote apps 4 them.. but volume of users is too low for most companies to invest. ☹️ https://t.co/ePsySxR3LB

— Joe Belfiore (@joebelfiore) October 8, 2017

It seems Microsoft too, has given up on their efforts to revive the windows phone platform. While this doesn’t come as a surprise, it still is disappointing to see a mobile OS with a lot of potential bite the dust. I’ve always found Windows Phone to have a much smoother UI than Android. Also, Microsoft’s Continuum demo did seem pretty nice. But the lack of users meant that app developers weren’t willing to invest the time and effort in developing for the Windows Phone OS. After all is said and done, Microsoft felt that it needed to shift it’s focus elsewhere, and it is certainly the right decision in my humble opinion.

Belfiore also reassured users of Windows Phone that support(ie, bug fixes, security updates, etc) for this platform wouldn’t be impacted by this. The only thing ending is further development of features for the platform.

One thing that I do have a gripe with however, is that Microsoft STILL hasn’t given an official announcement that it’s pulling the plug on it’s Windows Phone OS, leaving it’s (handful of) users still hopeful for a revival that wont be coming anytime soon. Guess these tweets from Belfiore are as official an announcement as we’ll get regarding this. Unfortunate that a company as big as Microsoft is deciding to “play safe” and not openly admit that they are giving up on their Mobile OS at least for the time being.

The post Microsoft (Un)offically brings down the curtain on Windows Phone appeared first on OCFreaks!.

G.Skill has been on a roll lately, releasing the fastest memory kits for all the recently released HEDT platforms(Intel-x299 and AMD-x399).

With the unveiling of Intel’s new 8th Gen Coffee lake CPUs and the Z370 platform, G.Skill is wasting no time in doing what they do best, ie, release the fastest DRAM for the platform. G.Skill just revealed their new “Extreme Trident Z” Memory Kits clocked upto a whopping 4600 MHz. These kits utilize Samsung’s B-die ICs, which are well known in the overclocking circles for their High performance and ability to handle extreme overclocking conditions. They come in two variants, with RGB LEDs(sigh!) and without.

While the Plain Trident Z (i.e., without RGB) consists of the lower capacity higher clocked higher latency kits, the Trident Z RGB lineup consists of the higher capacity lower clocked lower latency kits. You can get more details from this chart below:

As can be seen from the chart, the lineup is pretty diverse. The top of the line Trident Z kit(2×8 GB) is clocked at 4600 MHz(let that sink in!) and runs at 1.5 V. The RGB variants, while clocked much lower than their counterparts, do have tighter timings.

These memory kits will be available in November 2017. No word has been given on the pricing.

Source(s): G.Skill

The post G.Skill Announces new lineup of Trident Z Memory Kits for Intel’s Coffee Lake CPUs appeared first on OCFreaks!.

Introduction

The PC Cabinet space has seen a lot of changes in the recent years, both good and bad. It has certainly traversed a long way, and the cabinet has now become as much of a pièce de résistance of the PC build as it is just a humble container for the components. While I dont really mind much when manufacturers go to extreme lengths to just make a cabinet look better, it does get on my nerves when they choose to ignore the features and primary purpose of the cabinet in lieu of aesthetics, and use good looks as a justification for exorbitantly high prices. In this era of apparent hopelessness, comes the NZXT’s Source series as a breath of fresh air. With it’s simplistic styling, ample room and abundant features all at a reasonable price, it has earned the respect of many PC builders.

This review is of the Source 530, the biggest cabinet in the Source series.

Specifications

Packing and Accessories

The Source 530 comes in a corrugated cardboard packing which is pretty much standard for PC cases. On the front of the package is a front view render of the case. On the left side, an angular projection of the Source 530 in all it’s glory is printed out as a promo, and the right side features, ahem, the various features of the case. Vents are cut out in the front and back of the packing to make carrying it easier.

Inside the packing, you’ll find the case wrapped in a plastic sheet to shield it from moisture and dust. Styrofoam packing inserts are given in the top and bottom of the case to protect it from any shocks encountered while transit. A user manual is also provided with the case to help you with your build.

Packing Front

Packing Left

Packing Right

Packing Inside

• 
• 
• 
• 

Exterior

The Source 530 has a fully meshed front panel covered around the edges by plastic. The steel mesh is slightly angled on the top-right and bottom left portion. On the top portion of the front panel you’ll find an embossed NZXT logo, two USB 3.0 ports and 3.5 mm jacks for audio in and out. Below that there are three tool free (latch type detachable) 5.25″ bay covers that are also meshed to give a uniform look.

Exterior Front

Exterior Front Angled Parts

Exterior Front Drive Bays

Exterior Front IO

• 
• 
• 
• 

The right side lip of the plastic edge is slotted on the top for three buttons; Power, Reset and a third button that lights LEDs provided on the back for rear I/O. Pretty cool and innovative! The left side panel has a trapezoid shaped transparent window rivetted to it. The right side panel is just the regular plain steel. The side panels can be removed by removing the thumb screws on the back and simply sliding them out (duh!!!).

Exterior Right

Right Lipped Part Slot for Buttons

Exterior Left

• 
• 
• 

The top of the case is again, meshed(but with slightly bigger holes and pitch for exhaust). The top is slightly elevated at the middle to provide more clearance for thick radiators and/or fans. Three 120mm/Two 140mm fans and/or radiators can be mounted at the top. The mounting holes are kept slotted to account for any tolerances and position adustments.

Exterior Top

On the back of the case is the normal arrangement of one 120/140mm exhaust fan mount(with slotted mounting holes) and the backpanel slot at the top, eight expansion slot covers at the middle and the PSU mount at the bottom. Apart from these, you’ll also find 2 rubber grommets at the mid-right portion for passing through the tubes in case you’ve got an external water cooling setup. Pretty handy.

Exterior Back

Expansion

Grommets

• 
• 
• 

On the bottom of the case there is a tray type dust filter provided that can be slid out easily. Also, four rubber pads are given to keep the chassis stable and fixed.

Exterior Bottom

Exterior Bottom-Dust Filter

• 
• 

Interior

Removing the front panel exposes mounts for two 120/140mm fans or one 200mm fan.

Interior Front

Front Panel Removed

• 
• 

The left side of the chassis accomodates the motherboard tray, the drive and PSU bays. The motherboard tray comes prefitted with standoffs. It has an assymetrically placed cutout to provide access to the CPU Cooler backplate. Apart from this five other cutouts are provided for cable management. All the coutouts are hemmed to provide smooth edges. On the PSU bay, six rubber dampeners are provided to keep PSU induced vibrations and noise to a minimum. There is also space for an additional 120 mm fan towards the front of the PSU bay. The three 5.25″ external drive bays are tool-free and have latches to hold the drive in place. Below these are three modular 3.5″ drive cage sections that can house a total of upto 6 drives(Top Section-3; Mid Section-2; Bottom Section-1).The top section has a tiltable 120mm fan mount attached to it.

Interior Left

Interior Left w. Drive Cages Removed

Removed Drive Cages

Drive Cage

Drive Tray

Drive Bay Latch

PSU Rubber Dampeners

• 
• 
• 
• 
• 
• 
• 

On the right side you’ll find a 2.5″ Drive mount, perfect for low profile SATA SSDs. Adjacent to this NZXT has provided a PCB with all the chassis fan connections (FAN1-FAN11) broken out. Really helpful to keep the wiring organized when you use more than 4 fans in your chassis.

Interior Right

2.5″ Drive Mount

Fan Connections PCB

• 
• 
• 

NZXT provides two 120mm fans with the Source 530 case. One fitted at the back and the other at the top.

The Build

Specs:

Images:

Build Interior

CPU Cooler

Front Fans

Side Window

• 
• 
• 
• 

Temps:

Closing Thoughts

I must say I’m pretty impressed with the Source 530. Not only does it look simple and inconspicuous (No one’s gonna stare at THIS like it’s something that’s come straight out of a sci-fi movie!!!), it’s also a pretty capable performer in it’s own right. The temps achieved in our tests were pretty stable and well under control. For anyone who’s looking for a simple looking cabinet with a good build quality, I highly recommend having a look at the Source 530. Trust me. You wouldn’t be disappointed in the slightest.

The post NZXT Source 530 Full Tower Case Review appeared first on OCFreaks!.

Hi folks. In this step-by-step tutorial, I will show you how to compress videos using the free open-source tool Handbrake. This can prove especially useful to those who want to store lots of videos in devices with a limited storage capacity. Storing uncompressed large video files on such a device isn’t logical and is IMHO, downright stupid. This tutorial will get you acquainted with Handbrake and how you can use it to reduce the file size of large videos in a few minutes. You can download Handbrake from here. The detailed explanation of all the settings used in this tutorial can be found in my other articles on Handbrake(Links given at the bottom).

Without further ado, lets get started:

Step 1: Open Handbrake

Step 2: Importing Source File(s)

Import your video files to transcode by either dragging and dropping the file or clicking on “File” and navigating to the desired path. To batch encode all videos in a particular folder, click on “Folder” and navigate to the desired path. Select “MP4” container.

Handbrake Drag and Drop File

Handbrake File Open

Handbrake Folder Open

• 
• 
• 

Step 3: Picture Settings

In the Picture tab:

1. Select Anamorphic “Loose” and Modulus “2”.
2. Choose your desired Video Width. For mobile devices, I recommend a max resolution of 720p, which translates to a width of 1280 pixels for my input file (big_buck_bunny_1080p_h264.mp4).
3. Check Cropping “Custom” and make all values 0, if you don’t wish to crop your video. Or check “Automatic”, whichever works for you.

Step 4: Filter Settings

In the Filters Tab:

1. Select “NLMeans” Denoise with preset “Ultralight” and Tune “None”.

Step 5: Video Settings

In the Video Tab:

1. Select Codec “x264”, Framerate “Same as Source” and check “Variable Framerate”.
2. Check “Constant Quality” and keep the RF Slider between 21-25, no more, no less. I recommend using 24 for mobile devices.
3. Keep Encoder Preset Slider to “Veryfast”, and select Encoder Tune “Film”, Encoder Profile “Main” and Encoder Level “4.0”.

Step 6: Audio Settings

In the Audio Tab:

1. Select Codec “AAC (avcodec)”, select “Bitrate” and keep it to 160 or lower for mobile devices.

Step 6: Adding Subtitles

In the Subtitles Tab:

1. Add or remove Subtitles as per your wish.

Step 7: Finally, click on “Start Encode”

Step 7.1 (Optional): Get some coffee while your CPU does all the heavy lifting and compresses your video files & converts it to MP4 format!

For a more comprehensive, detailed and in-depth explanation of all the Handbrake settings, visit the following links:

• Handbrake Complete Tutorial Part 1: How to Transcode & Compress Videos
• Beginners Guide to Video Redundancies
• Handbrake Tutorial Part 2: x264 Advanced Encoding & Compression Settings Guide

The post How to Compress Video Files without much Quality Loss using Handbrake appeared first on OCFreaks!.

Specifications

KZ ED

KZ ES

Packing and Accessories:

The earphones came in separate cardboard boxes. For 14.75$, I really wasn’t expecting a whole lot of accessories (provided that I got 2 earphones at this price). So, I wasn’t disappointed (or pleasantly surprised ;-)) when I opened the box to find only the earphones with multiple pairs of silicone buds.

Packing

ES (on the left) and ED (on the right)

Silicone Buds (Left: ES; Right: ED)

Build Quality:

Both the earphones come with an inline mic and a single button remote. The cables are of fairly decent quality with negligible memory. They are sheathed in a translucent dark brown sleeve. The silicone earbuds provided with these earphones are pretty comfortable and fit snugly in the ear. The driver housing is the only distinguisishing feature (physically speaking) between the two earphones. In ES the drivers are housed in a cylindrical metal casing with a dark grey glossy finish. In ED the housing is a slightly tapered black colored cylinder with a diamond knurled outer surface, a meshed back and a gold finish nearing the nozzle. While The ED also has Red and Blue rings indicating the left and Right positions, the ES has straighforward L and R markings on the housing surface.

Overall, both appear to be well built and somewhat durable.

Driver Housing (Left: ES; Right: ED)

Nozzle (Left: ES; Right: ED)

Performance:

This is the part where the differences between the two start to emerge.

The performance of ES was a letdown. While the bass output was clear and punchy, heavily recessed mids and a bland treble performance ruined the whole deal for me. Compared to what most IEMs at this price range offer, I really wouldn’t call this outright terrible. Just mediocre, reiterating how cheap I got it for.

On the other hand, the ED, boy oh boy did it surprise me. After listening to the ES, I was preparing myself for another disappointment. I am happy to admit that I was wrong in thinking so. The bass was as clear and booming as can be and the mids and sub bass were slightly recessed. The treble output, while not as sharp as I’d like it to be, wasn’t that bad either. And the soundstage was as wide as can be expected in a low cost IEM.

To sum it up, while the ES has a more bassy sound signature, the ED has a more neutral tone that is just slightly prejudiced towards the bass.

Conclusion:

Now, the million dollar question that begs to be asked is are these worth it? About the ES, it really isn’t the only earphone on the market with a sound signature that is biased towards the lower frequencies, so I can’t in my right conscience recommend it. The ED, however, is honestly a pretty good IEM. A quick price check on AliExpress shows the ED priced between 8-15$. Anything below 10$, this earphone is the real deal, a steal. I know I sound like a telemarketer here, but trust me, I wouldn’t be saying this if it weren’t so. Above that however, it comes dangerously close to the price of Soundmagic’s ES18S. Between the two of them at that price point, the ES18S does have a slightly warmer sound signature and has more spark on the treble . Overall, it is the better performer. But then again the ED does surpass the ES18S in terms of build quality. So, it all comes down to preference. With that said, Kudos to KZ Acoustics for making a ridiculously low priced IEM that would put many higher priced ones to shame.

KZ ED

KZ ES

The post KZ ED special edition & ES earphones review appeared first on OCFreaks!.

For many PC enthusiasts looking to upgrade their rigs lately, the wait for AMD’s new Ryzen processors has been a sweet agony. Adding salt to the wound, heartless AMD has been providing potential buyers with juicy tidbits at just the right intervals to keep them from moving on. How much pain can an enthusiast take?!?! Well folks, I’m pleased to tell you the wait is finally over.

AMD has formally announced the release of Ryzen CPUs on a tech event held in San Francisco today, and they would reach the market on March 2nd. Initially, only the three Ryzen 7 CPUs (1800X, Ryzen 7 1700X and Ryzen 7 1700) will be released. The release of the rest of the lineup would follow thereafter.

In this event, AMD has also disclosed some new information about these processors that we were not privy to.

52% Better IPC

After the bulldozer fiasco, AMD decided that it would be much better to start with a clean slate. If you go by their words, this approach has worked wonders for them. Their target of 40% improvement in IPC over their previous chips (Excavator) was not only met, but exceeded! The Ryzen CPUs have 52% more IPC than the Excavator chips. Looks like Jim Keller (and his team, of course) has done it again!

Source: AMD

Die Shot

AMD has revealed a die shot of Ryzen processors. Built on a 14nm process node, the 8 core Ryzen CPU consists of 4.8 billion transistors and 2000m of signal wiring. The AMD team responsible for Ryzen has reportedly spent two million engineering hours over the architecture. Looking at the benchmark results (that are revealed till now), it looks like all that hard work has finally paid off.

Source: AMD

Benchmark Demos

AMD CEO Lisa Su showed three demos pitting Ryzen 7 1700X against Intels Core i7-6800K. The demos run included Cinebench, HandBrake, and a 4K gaming session. See how Ryzen fared in these tests below:

Source: pcper

In the 4K Gaming Session, AMD showed a Ryzen (Ryzen 7 1800X) processor and an Intel Broadwell-E (Core i7-6900K) processor running a demo version of Sniper Elite 4 side by side. The average frame rate (70-80 FPS) was similar on both the systems and the differences, if any, were imperceptible.

From all this, it can be seen how Intel has a serious competitor on it’s hands in the form of Ryzen.

Retail Packing and Coolers

AMD also unveiled the retail packaging and their new Wraith Spire Heat Sink Fans for select Ryzen processors. Have a look below:

Source: AMD

Apart from all this, here is some more miscellaneous information about the Ryzen 7 processors and AM4 Mobo Chipsets that AMD was kind enough to share:

Source: legitreviews

Source: wccftech

Ryzen 7 CPUs and AM4 Mobos are now officially available for pre order at following prices:

Amazon:

Ryzen 7 1800X – $499 – Amazon.com
Ryzen 7 1700X – $399 – Amazon.com
Ryzen 7 1700 – $329 – Amazon.com

ASUS ROG Crosshair VI Hero – $255 – Amazon.com
ASUS Prime X370-Pro – $170 – Amazon.com
ASUS Prime B350-Plus – $99.99 – Amazon.com
ASUS Prime B350M-A/CSM – $89.99 – Amazon.com

MSI X370 XPOWER GAMING TITANIUM – $299.99

Gigabyte GA-AX370-Gaming 5 – 194.99$
Gigabyte GA-AB350-Gaming 3 – 109.99$

Newegg:

AMD RYZEN 7 1800X 3.6 GHz (4.0 GHz Turbo)
AMD RYZEN 7 1700X 3.4 GHz (3.8 GHz Turbo)
AMD RYZEN 7 1700 3.0 GHz (3.7 GHz Turbo)

BIOSTAR X370GT7 – $209.99
BIOSTAR X370GT5 – $149.99
BIOSTAR B350GT5 – $129.99

Now, before anyone jumps the gun seeing all this and indulges in their fanboyish whims by pre-ordering, I urge you to remember that the only benchmark results available of Ryzen CPUs as of now are either from AMD themselves (which could be cherry picked) or from unofficial leaks (which could very well be fake). So, it would be better if you wait till some reviews of them show up. You did wait till now, what’s another 1.5-2 weeks.

You can have a look at the Ryzen Launch Event below:

Source(s): pcper, wccftech, legitreviews

The post AMD Ryzen Official Release and Pre Order appeared first on OCFreaks!.

New Update on AMD Ryzen: Official release, Benchmarks and pre-order list

With the launch of AMD’s new Ryzen CPUs inching closer, more and more information is surfacing about them online. Not even two days past the leak about the the full lineup and pricing, Ryzen CPUs have been seen listed for pre-order on multiple online stores, with a Thai retailer revealing the legit box-art. Have a look.

Source: Wccftech

AMD has chosen to go with a “less is more” approach for their box art, consisting of a black background with the Ryzen logo in the middle. A small AMD logo can be seen right below the Ryzen logo, and on the top-right corner of the package. The left side of the box contains a short passage giving the features of the processor. Judging from the thickness of the package, it is fair to say that the CPU cooler will be bundled along with the processor. The coolers look amazing, complete with RGB lighting (apparently the biggest innovation of the year 2016 😀 ) From all the praise the new AMD stock coolers (Wraith) have been getting, this is a good move by AMD, as it could allow the XFR enabled processors to reach higher clock speeds.

The prices listed here are a bit on the higher side. The final pricing is expected to be lower than this(according to the leaks, anyway). A Belgian retailer (Centralpoint.be) also has listed Ryzen 7 CPUs as available for pre-order. Heres the list:

Source: Centralpoint.be via Wccftech

What intrigues me here is that they have two SKU listings for each part, with a €20 price difference between the two SKUs (for the same product), except for the R7 1700, whose two SKUs are priced the same too. Maybe they’ve messed up on the naming.The pricing given here is closer to what the leaked pricing suggests.

The Ryzen CPUs are expected to be released at Feb 28th 2017 – the same date AMD will host its ‘Capsaicin & Cream'(GDC) 2017 press event.

Source(s): Wccftech(1) Wccftech(2)

The post AMD Ryzen CPUs listed for online pre-order appeared first on OCFreaks!.